Intelligence analyses covering power across geopolitics, cybersecurity, finance, and technology domains.
4 analyses
Semiconductor supply chains have become the primary bottleneck in AI competition - TSMC capacity constraints are "choking the supply chain in 2026" [Source: Broadcom executive, Mar 2026], with advanced node production allocated through 2027 and packaging constraints limiting AI chip assembly [Source: IndexBox, Mar 2026].
Private Capital Acceleration Compresses Deployment Timelines
Tungsten Supply Concentration Creates Strategic Leverage
The global tungsten market has entered 2026 in extreme volatility, driven by China's implementation of export controls on tungsten products following US trade disputes .